Built for
Every Challenge.
From 0201 miniature passives to complex BGA packages, from single-board prototypes to high-volume production runs — our 2,000㎡ facility, five SMT lines with AOI / SPI, and 50+ staff scale to match your project requirements.
What We Build
A comprehensive suite of assembly and manufacturing services — all under one roof, all held to the same uncompromising standard.
SMT Assembly
High-speed surface-mount assembly using Yamaha YSM40R pick-and-place machines. We handle component sizes down to 01005 (0.4mm × 0.2mm) with ±25μm placement accuracy at speeds up to 75,000 CPH.
THT / Through-Hole Assembly
Automated wave soldering and selective soldering for through-hole components, combined with skilled manual soldering for complex connectors, transformers, and press-fit parts.
BGA & Advanced Packages
Full capability for BGA, CSP, QFN, LGA, and flip-chip packages. Every BGA joint is verified by 2D/3D X-Ray post-reflow. We also offer BGA reballing and rework services.
Flex & Rigid-Flex PCB Assembly
Specialized assembly for flexible and rigid-flex boards, including custom support fixtures and controlled-impedance reflow profiles to prevent delamination or conductor damage.
Box Build & System Integration
Complete electromechanical assembly — from sub-assembly to full system integration. We handle wire harnessing, cabinet assembly, and final product functional testing.
Prototype & NPI Services
Dedicated NPI engineering team for rapid prototyping (72-hour turnaround), DFM analysis, DFA review, and first article inspection. We accelerate your time-to-market without cutting corners.
Inside Our Manufacturing Lines
Purpose-built production lines, maintained to the highest standards, with real-time data collection at every stage.
5 Fully Automated SMT Lines
Each of our five SMT lines runs a closed-loop process chain: screen printer → 3D SPI → pick-and-place → nitrogen reflow oven → 3D AOI. Real-time SPC data is fed back to upstream machines automatically.
- Yamaha YSM40R high-speed mounters
- DEK Horizon screen printers with vision alignment
- 10-zone nitrogen reflow ovens
- Closed-loop SPC feedback control
- Full MES traceability on every board
Multi-Stage Verification at Every Step
A dedicated inspection zone sits between every major process step. Our engineers review AOI escapes and X-Ray images daily, feeding findings back into our process control database to prevent recurrence.
- 100% inline 3D AOI post-reflow
- X-Ray for all BGA & hidden-joint components
- Flying probe & bed-of-nails ICT
- Customer-defined functional test (FCT)
- Burn-in & environmental stress screening
Trusted Global Component Sourcing
Our procurement team maintains relationships with 200+ authorized distributors globally — including Avnet, Arrow, Mouser, and Digi-Key — ensuring genuine parts, competitive pricing, and no end-of-life surprises.
- Authorized distributor partnerships
- Anti-counterfeit verification (AS6081)
- MSD baking per JEDEC J-STD-033
- Bonded inventory program available
- Long-lead-time risk mitigation planning
Our Production Workflow
A transparent, milestone-driven process so you always know exactly where your project stands.
DFM Review
Engineering team reviews your Gerbers, BOM, and assembly drawings for manufacturability risks before production begins.
Component Sourcing
All components are procured from authorized channels and pass IQC verification before entering the production floor.
SMT & Assembly
Boards are processed through our automated SMT lines, followed by THT, BGA, and box-build stages as required.
Test & Ship
100% inspection, functional testing, and final OQC before packaging. Flexible delivery—staged shipments, scheduled releases, and global shipping with full traceability docs.
Manufacturing Specifications
Precise parameters and tolerances across our production capabilities.
Production at Any Volume
Whether you need 5 prototype boards or 500,000 units per month, our flexible production scheduling and dedicated NPI cells ensure you get consistent quality at every scale.
Capacity
In-Service
Turnaround
Partners
Industries We Serve
Our team brings deep application knowledge across a wide range of demanding end markets.
Medical Devices
ISO 13485 certified. Full traceability, lot control, and design-freeze documentation for Class I–III devices.
Automotive
IATF 16949 compliant. AEC-Q qualified components, automotive-grade process controls for harsh-environment electronics.
Industrial Control
Reliable assembly for PLCs, motor drives, power conversion modules, and HMI systems demanding long service life.
Energy & Power
High-reliability assemblies for solar inverters, EV chargers, battery management systems, and smart grid equipment.
IoT & Consumer
Flexible NPI and mass-production support for connected devices, wearables, and consumer electronics with rapid iteration cycles.
Aerospace & Defense
AS9100D-aware processes, conformal coating, and rigorous traceability for mission-critical avionics and defense hardware.
Telecom & Networking
High-density, high-layer-count PCBAs for switches, routers, base stations, and 5G infrastructure equipment.
R&D & Startups
Engineering-first approach for research institutions and startups — from breadboard to pilot production with expert DFM guidance.
Materials & Component Support
We work with the full spectrum of board materials and component packaging formats — including legacy and exotic types.
PCB Substrate Materials
- FR-4 / High-Tg FR-4Standard and high-temperature variants (Tg up to 170°C)
- Rogers / PTFE LaminatesHigh-frequency RF boards — Rogers 4003C, 4350B, RT/duroid
- Aluminum / Metal Core (MCPCB)High-power LED and power electronics thermal management
- Polyimide (Flex)Kapton-based single and multi-layer flexible circuits
- Rigid-Flex CombinationsMixed rigid-flex stackups for compact, wearable designs
- Ceramic SubstratesAlN and Al₂O₃ for extreme thermal and RF applications
Component Package Support
- SMD Passives01005 to 2512, chip resistors, capacitors, inductors
- IC PackagesSOP, QFP, SOIC, SOT, TO-xxx, DPAK, D²PAK
- Area Array PackagesBGA, PBGA, CBGA, CSP, LGA, flip-chip
- Fine-Pitch ICsQFN, DFN, SON, WLCSP (down to 0.3mm pitch)
- Through-HoleDIP, SIP, connectors, transformers, relays, power modules
- Press-Fit & MixedAutomotive press-fit connectors, mixed SMT/THT assemblies
Let's Build Your Next Product Together
Upload your Gerbers, BOM, and assembly files and receive a detailed DFM report and quotation within 24 hours — no obligation.